In addition to our standard product offerings, Fujikura can supply customized products specific to our customer’s requirements. Our experienced engineers can provide the optimal solution for a broad array of applications.
Fujikura’s miniature CMOS image sensor modules combine miniature color CMOS image sensor with wafer level optics and miniature coaxial cable to provide the highest quality image in the smallest form-factor.
WABE PackageTM (Wafer and Board Level Embedded Package) embeds IC chip(s) by combining a multilayer FPC technology and a thin WLP technology. This technology reduces the size of electronic devices while simultaneously increasing their functionality.