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- Miniaturization Technology
Miniaturization Technology
Fujikura Group’s deep experience in the fabrication of electronic components and the assembly of specialty fibers allows us to supply ultra-small components and miniaturization through our proprietary micro-processing technology. This expertise makes Fujikura an ideal partner for Minimally-Invasive medical devices.
Miniature CMOS Image Sensor Module
Fujikura’s miniature CMOS image sensor modules combine miniature color CMOS image sensor with wafer level optics and miniature coaxial cable to provide the highest quality image in the smallest form-factor.
WABE PackageTM
WABE PackageTM (Wafer and Board Level Embedded Package) embeds IC chip(s) by combining a multilayer FPC technology and a thin WLP technology. This technology reduces the size of electronic devices while simultaneously increasing their functionality.
Sensor
The AG3 pressure sensor provides very smooth analog voltage proportional with the applied pressure and has low noise. As a result, the AG3 pressure sensor is good ideal for NIBP (Non-invasive blood pressure) monitoring.
Micro coaxial (MCX) cable assembly
Features of MCX cable assemblies
・High bending and twisting characteristics for complex cable routing.
・High resistance to noise, high-speed transmission, and excellent EMI characteristics.
・Wide variety of cable variations.
・Wide variety of terminal assembly.
・Custom products can be designed to meet customer requirements.
・Integrated production from cable to assembly in a single factory is possible.
PSH compact miniature coaxial connector
PSH compact miniature coaxial connector provides the optimal balance of performance and size. This surface mounted (SMT) RF connector with VSWR performance of 1.3 at DC to 3GHz and VSWR of 1.5 at 3 GHz to 6 GHz and a stacking height of 2.0mm or 2.5mm.
PSH2 ultra-compact miniature coaxial connector
PSH2 ultra-compact miniature coaxial connector provides the optimal balance of performance and size. This surface mounted (SMT) RF connector with VSWR performance of 1.3 at DC to 3GHz and VSWR of 1.5 at 3 GHz to 6 GHz and a stacking height of 1.5mm.
Connector BNC75 Series for 12G-SDI
BNC75 series for broadcasting equipment is a high performance 75 Ω connector which is compliant with the 12G-SDI standard by improving impedance matching of the conventional product.
FPC Connector
DDK’s(*1) original cam-type back-lock system provides reliable operation and ensures retention from inadvertent upward pulling of the FPC. Simplify your assembly with less time and more reliability.
Long Length FPC
Wiring material that utilizes a fine pitch circuit to take advantage of the characteristics of FPC, offering thin, soft, and bendable circuits.
FPC can offer both space-savings and high-density wiring possibilities.
